In-depth survey report: control technology for microelectronics industry at Xerox Corporation, Microelectronics Center, El Segundo, California.

Details

• Personal Author:
  Jones JH ; Mihlan GJ ; Ungers LJ
• Description:
  An indepth survey of control technology at Xerox Corporation, Microelectronics Center (SIC-3674), El Segundo, California was conducted in November, 1982. The survey was part of an industrywide study of exposures in the microelectronics industry. Engineering controls included general and exhaust ventilation, an automated gas handling system, toxic and combustible gas monitoring systems, drain systems for waste organic solvents, and lucite covers and metal mesh screens across viewing ports to control ultraviolet and radiofrequency emissions. Sampling was conducted for arsenic (7440382), arsine (7784421) diborane (19287457), hydrogen-chloride (7647010), hydrogen-fluoride (7664393), phosphine (7803512), organic solvent vapors, and ultraviolet and radiofrequency emissions. All chemical exposures except for hexamethyldisilizane (999973), for which there is no Federal standard, were below their evaluation criteria. Hexamethyldisilizane concentrations ranged from 74 to 468 micrograms per cubic meter. No excessive exposures to ultraviolet radiation were detected. Significant radiofrequency emissions, 400,000 square Volts per square meter (V2/m2), were detected near a plasma stripper. The threshold limit value is 18,000V2/m2. The authors note that since employees spend no more than 1 or 2 minutes near the plasma stripper, significant radiofrequency exposure from this source is not likely.
• Subjects:
  Accidents, Occupational Acoustics Noise Noise, Occupational Occupational Health Safety
• Keywords:
  Air-quality-monitoring Control-methods Control-technology Electronics-industry Employee-exposure Exposure-levels Field-Study Health-protection NIOSH-Author NIOSH-Survey Quantitative-analysis Region-9 Toxic-gases

  More +
• DOI:
  https://doi.org/10.26616/NIOSHECTB11512b
• Publisher:
  National Institute for Occupational Safety and Health
• Document Type:
  Text
• Genre:
  Field Studies ; Control Technology
• Place as Subject:
  California ; Ohio ; OSHA Region 5 ; OSHA Region 9
• CIO:
  National Institute for Occupational Safety and Health (NIOSH)
• Division:
  DPSE - Division of Physical Sciences and Engineering
• Topic:
  Workplace Safety & Health
• Location:
  North America
• Pages in Document:
  1-94
• NIOSHTIC Number:
  nn:00145152
• Citation:
  Cincinnati, OH: U.S. Department of Health and Human Services, Public Health Service, Centers for Disease Control, National Institute for Occupational Safety and Health, ECTB 115-12b, 1984 Aug; :1-94
• CAS Registry Number:
  Arsenic (CAS RN 7440-38-2) ; Arsine (CAS RN 7784-42-1) ; Diborane (CAS RN 19287-45-7) ; Hydrochloric acid (CAS RN 7647-01-0) ; Hydrofluoric acid (CAS RN 7664-39-3) ; Phosphine (PH3) (CAS RN 7803-51-2) ; Hexamethyldisilazane (CAS RN 999-97-3)
• Federal Fiscal Year:
  1984
• Peer Reviewed:
  False
• NAICS and SIC Codes:
  3674 - Semiconductors and related devices - (SIC)
• Collection(s):
  National Institute for Occupational Safety and Health
• Main Document Checksum:
  urn:sha-512:052d179710201470a1172832ba54f15f4b734e3550a8db1cfd8a38ae207908bb2399615b855dcd2e96565f37a2a012c0a1f6022ec29d10412aaedb257a2c5894
• Download URL:
  https://stacks.cdc.gov/view/cdc/179710/cdc_179710_DS1.pdf
• File Type:
  [PDF - 1.76 MB ]