Characterization of source activity and emission factors for wave soldering

Details

• Personal Author:
  Conroy LM ; Franke JE ; Milz SA ; Scheff PA ; Wadden RA ; Conroy LM ; Franke JE ; Milz SA ; Scheff PA ; Wadden RA
• Description:
  Emission rates and emission factors for lead particles were developed based on data collected during production in a space containing three wave soldering lines at a semi-conductor manufacturing plant. Twelve onehour air samples for particulate matter were collected on polycarbonate filters over a two-day period at ten sampling locations around the lines. The particulate matter on the filters was analyzed for elemental composition using Proton Induced X-Ray Emission Spectroscopy. source activity data were recorded during the entire twelve hours for each of the three lines. The observations included board type, number of boards, number and duration of hood cover openings, and number of scrapings and dedrossings. The collected hourly concentration data and ventilation rates were used with a box model describing a lead mass balance on the space to calculate the combined hourly emission rate from all three lines. The average lead emission rate was 50 mg/hr. Emission factors were calculated using the emission rate estimates. The resulting relationships indicated that total board count and total pot scrapings and dedrossings best described the overall lead emissions from all three lines. These emission factors can then be used to estimate emissions for other wave soldering lines in the semi-conductor industry. In addition, chemical mass balance (CMB) receptor modeling was carried out on the area samples to determine the fraction of the measured lead concentration at each sampling site which was emitted from each of the three wave lines. In a space containing multiple sources, the CMB approach has the potential to provide a quantitative estimate of the fraction of each workplace sample which is due to emissions from each specific source. In this study, the allocation procedure resulted in individual line concentrations which were in good agreement with scraping and dedrossing activities for the specific line most likely to affect the area concentrations. This agreement suggests that the CMB can serve as a useful evaluating tool for discriminating the contribution of individual sources to area and personal concentrations. [Description provided by NIOSH]
• Subjects:
  Environmental Exposure Environmental Monitoring Lead Occupational Health Particulate Matter Safety Spectrum Analysis Ventilation
• Keywords:
  Air Samples Emission Sources Exposure Levels Filters Models Particulates Sampling Semiconductor Manufacturing Soldering Spectrographic Analysis
• Publisher:
  American Industrial Hygiene Association
• Document Type:
  Text
• Funding:
  Grant
• Genre:
  Abstract or Summary ; Abstract or Summary
• Place as Subject:
  Illinois ; Missouri ; OSHA Region 5 ; OSHA Region 7
• CIO:
  National Institute for Occupational Safety and Health (NIOSH) ; National Institute for Occupational Safety and Health (NIOSH)
• Topic:
  Workplace Safety & Health ; Workplace Safety & Health
• Location:
  North America ; North America
• Pages in Document:
  18
• NIOSHTIC Number:
  nn:20048187
• Citation:
  American Industrial Hygiene Conference and Exposition, May 20-26, 1995, Kansas City, Missouri. Fairfax, VA: American Industrial Hygiene Association, 1995 May; :18
• CAS Registry Number:
  Lead (CAS RN 7439-92-1) ; Lead (CAS RN 7439-92-1)
• Federal Fiscal Year:
  1995
• Performing Organization:
  University of Illinois at Chicago, Illinois
• Peer Reviewed:
  False
• Start Date:
  19901201
• Source Full Name:
  American Industrial Hygiene Conference and Exposition, May 20-26, 1995, Kansas City, Missouri
• End Date:
  19941130
• Collection(s):
  National Institute for Occupational Safety and Health
• Main Document Checksum:
  urn:sha-512:8c2ad08037d8a3f8ad473bd30a9ed2dd42463349d755b8ef37f771ef8500fe00b7f4cf9839cc13cea7979cb5c9ce68f247d4cc81405d0e466cbbf8f38602f954
• Download URL:
  https://stacks.cdc.gov/view/cdc/203006/cdc_203006_DS1.pdf
• File Type:
  [PDF - 427.93 KB ]