Method for Soldering Aluminum and Magnesium
Public Domain
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1986/09/23
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Series: Mining Publications
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Personal Author:
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Description:Aluminum, magnesium, or their alloys are soldered by means of a tin- lead system following initial application of a thin coating of nickel-copper alloy. Thus, 1100 aluminum alloy pieces were chemically etched to clean surfaces and then given an electroless zincate treatment to deposit a thin layer of zinc, using cotton swabs to apply the solution. A ni-cu coating then was applied to the surfaces to be soldered by an electrolytic brush-coating method. Five to ten milliliters of an electrolyte containing 125 g/l of nickel acetate, 10 g/l of copper acetate and 5 g/l of boric acid were applied to the metal pieces as cathodes, and the ni-cu coating deposited with the aid of an anode consisting of a 70 pct ni-30 pct cu rod wrapped with a layer of gauze over cotton batting. The process took about 2 min at a current density of 200 ma/cm2 (based on the contact area between the anode stylus and the ni-cu alloy coating). The deposited alloy layer was about 2 microm thick and contained 50-60 pct ni. The alloy coated aluminum pieces then were soldered using conventional techniques with 60 pct pb-40 pct sn solder and a rosin-type flux. The strengths of the joints were similar to joints between copper-copper or brass-brass substrates. The ni-cu alloy layer can also be applied by a conventional electrolytic cell method using the same electrolyte composition as for the brush-plating technique. [Description provided by NIOSH]
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Pages in Document:1-6
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NIOSHTIC Number:nn:10005490
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Citation:US Pat 4,613,069 1986 Sep; :1-6
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CAS Registry Number:
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Federal Fiscal Year:1986
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Peer Reviewed:False
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Source Full Name:United States Patent 4,613,069
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Main Document Checksum:urn:sha-512:50160f67042aa2b160758701fae3ea5bae9d25880f67999acf46f065c8132500893c1b11a270eeafe11d134cbb4ef53c74c30bd21cf7a4f0b21fbd0a35294c06
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