Characterization of source activity and emission factors for a copper plating line

Details

• Personal Author:
  Conroy LM ; Franke JE ; Milz SA ; Scheff PA ; Wadden RA ; Conroy LM ; Franke JE ; Milz SA ; Scheff PA ; Wadden RA
• Description:
  Emission rates and emission factors were developed for copper and sulfur based on data collected during production of an eleven-tank copper plating line at a semi-conductor manufacturing plant. Hourly air samples for particulate matter were collected on polycarbonate filters over a two-day period at five locations around the line. The particulate matter on the filters was analyzed for elemental composition using Proton Induced X-Ray Emission Spectroscopy. In addition, source activity data were recorded during the entire twelve-hour sampling period. The observations included board code, rack size, number of boards, tank number, plating current, and temperature of the plating bath. The collected hourly concentration data and ventilation rates were used with mass balance models to calculate hourly emission rates. The average copper emission rate was 487 ug/min. The average sulfur emission rate varied from 983 ug/min to 1232 ug/min depending on the mass balance model. Source activity variables were averaged (rack size, current, temperature) or totaled (number of boards) for each of the twelve sampling hours. In addition, three other activity variables were calculated for each sampling hour. These calculated activity variables included the total square inches of boards entering the plating baths each hour, the total square inches of boards being plated each hour, and the total effective energy each hour, which was calculated by multiplying the current by the plating time. As expected, the area plated was highly correlated with the product of current and time interval in the plating bath. Emission factors were then calculated for all four emission rate estimates. The resulting equations indicated that the total effective energy and the total square inches of boards entering the plating baths each best described the copper and sulfur emissions. These emission factors can then be used to estimate emissions for other copper plating lines in the semiconductor industry. [Description provided by NIOSH]
• Subjects:
  Air Pollutants, Occupational Chemistry Environmental Exposure Environmental Monitoring Occupational Health Particulate Matter Risk Assessment Risk Factors Safety Sulfur Compounds Ventilation Workplace

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• Keywords:
  Airborne Particles Airborne Particulates Air Sampling Chemical Composition Chemical Properties Copper Compounds Emission Sources Exposure Levels Filters Models Particulates Risk Factors Sampling Sulfur Compounds Work Environment Workers

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• Publisher:
  American Industrial Hygiene Association
• Document Type:
  Text
• Funding:
  Grant
• Genre:
  Abstract or Summary ; Abstract or Summary
• Place as Subject:
  Illinois ; OSHA Region 5
• CIO:
  National Institute for Occupational Safety and Health (NIOSH) ; National Institute for Occupational Safety and Health (NIOSH)
• Topic:
  Workplace Safety & Health ; Workplace Safety & Health
• Location:
  North America ; North America
• Pages in Document:
  37-38
• NIOSHTIC Number:
  nn:20048191
• Citation:
  American Industrial Hygiene Conference and Exposition, May 21-27, 1994, Anaheim, California. Fairfax, VA: American Industrial Hygiene Association, 1994 May; :37-38
• CAS Registry Number:
  Copper (CAS RN 7440-50-8) ; Sulfur (CAS RN 7704-34-9) ; Copper (CAS RN 7440-50-8) ; Sulfur (CAS RN 7704-34-9)
• Federal Fiscal Year:
  1994
• Performing Organization:
  University of Illinois at Chicago, Illinois
• Peer Reviewed:
  False
• Start Date:
  19901201
• Source Full Name:
  American Industrial Hygiene Conference and Exposition, May 21-27, 1994, Anaheim, California
• End Date:
  19941130
• Collection(s):
  National Institute for Occupational Safety and Health
• Main Document Checksum:
  urn:sha-512:69966ff18b2bcd73899186f5242070cfb76914f4d6031203e3fe693d1930261851140ddcc6da0a3de620e12fbe3fbde29a4b7e4753dae2a7f220314926e088ad
• Download URL:
  https://stacks.cdc.gov/view/cdc/203010/cdc_203010_DS1.pdf
• File Type:
  [PDF - 3.05 MB ]